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Arbon Fiber Membrane Forming Hot and Cold Integrated Machine
The precision temperature control chiller-heater unit dedicated to the semiconductor industry is a key process equipment integrating heating, cooling and closed-loop temperature control. It can achieve precise temperature control within ±0.05℃ to ±0.1℃ in a wide range of -100℃ to +300℃, providing a stable thermal environment for processes such as lithography, etching, doping and packaging testing, which directly affects the yield and performance of chips.
Perkara No :
LCH-30W(A)-60KWPesanan(MOQ) :
1Bayaran :
EXW/FOB/CIF/FCA/DPU/DDUAsal Produk :
CHINAwarna :
CustomizablePelabuhan Penghantaran :
SHANGHAI/NANJINGMasa Utama :
25Berat badan :
300KG
Integrated hot and cold temperature control unit
The equipment is based on a refrigeration cycle with compression and electric heating compensation, and achieves high-precision temperature control through a closed-loop control system:
Refrigeration side: Compressor → Condenser → Expansion Valve → Evaporator. The refrigerant phase change is utilized to remove heat, allowing the temperature to drop rapidly to -100℃ or lower.
Heating side: The PID algorithm drives the electric heater to precisely compensate for heat, achieving temperature rise and stable constant temperature.
Closed-loop control: PT100/PT1000 platinum resistance sensors continuously collect the medium temperature, combined with feedforward-PID or model predictive control (MPC), dynamically adjust the cooling/heating power, suppress load disturbances, and the steady-state accuracy can reach ±0.05℃.
Clean circulation: Fully sealed pipeline + oil-free design, avoiding medium contamination, in line with SEMI S2/S8 standards, suitable for fluorinated liquids, ethylene glycol water solutions and other special heat-conducting media.
FeaturesLithography process: Cool the DUV/EUV light source and optical system, with temperature control accuracy of ±0.05℃, to prevent thermal expansion from causing overlay errors.
Etching process: Adjust the temperature of the etching solution (20℃~80℃), stabilize the etching rate, and reduce the surface roughness of the wafer.
Doping and annealing: Thermal diffusion (150℃~300℃), post-ions injection annealing (80℃~200℃), to repair lattice damage and activate dopant atoms.
Packaging and testing: High and low temperature cycling (-40℃~+150℃) to simulate extreme environments, verify device reliability, with temperature rise and fall rates up to 5℃/min.
Wafer-level heat dissipation: Multi-channel independent temperature control, providing uniform cooling for advanced packaging (such as CoWoS, Chiplet), suppressing thermal crosstalk.
Q1:Unable to Reach the Set Temperature
A1:This may be caused by refrigerant leakage, compressor failure, or blockage in the circulation system. It is necessary to check if the refrigerant is sufficient, repair the leakage point and recharge the refrigerant; inspect the status of the compressor and perform maintenance or replacement if needed; clean the circulation system to eliminate blockages.
Q2:Abnormal noise from the water pump or failure to operate normally.
A2:Inspect the condition of the water pump impellers and bearings; replace them if damaged. Check whether the motor connections are in good condition and ensure the power supply is normal.
Q3:Slow Heating/Cooling Rate
A3:Ensure the heater/cooler is functioning properly; it may be necessary to replace the electric heating element or refrigeration element. Check if the heat exchanger is blocked or contaminated—cleaning the heat exchanger can restore its performance. Ensure the refrigerant circulates smoothly; it may be required to inspect and clean the refrigerant pipelines.
Q4:Can you provide OEM or customized solutions?
A4: Yes, we offer OEM service and tailor-made temperature control systems according to your specific process requirements (temperature range, medium, cooling capacity, etc.).
The precision temperature control chiller-heater unit dedicated to the semiconductor industry is a key process equipment integrating heating, cooling and closed-loop temperature control. It can achieve precise temperature control within ±0.05℃ to ±0.1℃ in a wide range of -100℃ to +300℃, providing a stable thermal environment for processes such as lithography, etching, doping and packaging testing, which directly affects the yield and performance of chips.
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